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Item: 5G Thermal Pads Conductive Heatsink Plaster
Use for electronic,LED,Chip,VGA,RAM,IC,Memory or other heat dissipation part.
Note: it has a strong viscous ability, can't remove it after it was getting solid. don't recommend using it in your CPU and GPU processor.
Condition:100% New
Package:3pcs/lot
Thermal properties: strong adhesion.
Thermal conductivity: > 0.671W/m-K Thermal
Net Weight: 5g
Strength of connected buildings:1.5map
Active use period: 10 (min)
Shelf life: 12 (months)
Color: White
Thermal conductivity: >0.671W/m.k
Surface curing time: 10MIN/25
Features:
1. It has good conductivity and a wide service temperature range(-60~200), short term 300 high temperature.
2. The surface curing time is short, the adhesive force is strong, the storage period is long, non-toxic, and solvent-free.
3. It can be applied safely in elastic adhesion, heat dissipation, insulation, and encapsulation in electronics, electrical appliances, instruments, LED, heat sinks, and other industries.
4. It is suitable for all kinds of components, LED and heat dissipation devices that need to be bonded directly. It has high strength and a fast adhesion effect.
Operation Manual:
1. When it is used, the product is directly extruded, rubbed, and glued to the surface of the adhesive, and then covered immediately after the test, to be tried again.
2. The surface fixed speed is related to the relative humidity and temperature in the air; the higher the temperature, the faster the curing rate is, the slower the vice versa.
3. Recommended coating thickness: 0.1-0.5mm, the thinner the better.
4. Before use, please clean with solvent (such as alcohol) adhesive surface, detergents should be surface to be clean before painting.
